Kubva munhoroondo yekuvandudza chip, iyo nzira yekuvandudza chip ndeyekumhanya, yakakwira frequency, yakaderera simba rekushandisa.Chip kugadzira maitiro anonyanya kusanganisira chip dhizaini, chip kugadzira, kurongedza kugadzira, mutengo wekuyedza uye zvimwe zvinongedzo, pakati peiyo chip yekugadzira maitiro inonyanya kuoma.Ngatitarisei nzira yekugadzira chip, kunyanya iyo chip kugadzira.
Yekutanga ndeye chip dhizaini, zvinoenderana nezvinodiwa zvekugadzira, iyo inogadzirwa "pattern"
1, iyo yakabikwa yechip wafer
Kuumbwa kwewafer isilicon, silicon inonatswa nejecha requartz, chidimbu chesilicon element inonatswa (99.999%), uye ipapo iyo yakachena silicon inogadzirwa kuita silicon tsvimbo, inova iyo quartz semiconductor zvinhu zvekugadzira yakabatanidzwa redunhu. , chimedu ndicho chinodiwa chaizvo chechipisi chekugadzira chip.Iyo yakatetepa iyo chimedu, inodzikira mutengo wekugadzira, asi iyo inokwirisa maitiro ezvinodiwa.
2.Wafer kupfeka
Iyo wafer yekuputira inogona kuramba oxidation uye tembiricha, uye zvinhu imhando yephotoresistance.
3, wafer lithography kukura, etching
Maitiro acho anoshandisa makemikari anonzwa kune UV mwenje, inovapfavisa.Chimiro che chip chinogona kuwanikwa nekudzora nzvimbo ye shading.Silicon wafers akaputirwa ne photoresist kuitira kuti anyunguduke mu ultraviolet chiedza.Apa ndipo panogona kuiswa shading yekutanga, kuitira kuti chikamu chechiedza cheUV chinyunguduswe, chinogona kubva chashambidzwa nesolvent.Saka mamwe acho akafanana nemumvuri, izvo zvatinoda.Izvi zvinotipa silica layer yatinoda.
4, Wedzera tsvina
Ioni dzakasimwa muwafer kuti dzigadzire inoenderana P uye N semiconductors.
Maitiro acho anotanga nenzvimbo yakavhurika pane silicon wafer uye inoiswa mumusanganiswa wemaoni emakemikari.Maitiro acho achachinja nzira iyo dopant zone inoitisa magetsi, ichibvumira yega yega transistor kubatidza, kudzima kana kutakura data.Machipisi akareruka anogona kushandisa dhizaini imwe chete, asi machipisi akaomarara anowanzo aine akawanda akaturikidzana, uye maitiro acho anodzokororwa kakawanda, aine akasiyana akaturikidzana akabatana nehwindo rakavhurika.Izvi zvakafanana nemusimboti wekugadzira weiyo layer PCB board.Mamwe machipisi akaomarara anogona kuda akawanda akaturikidzana esilica, ayo anogona kuwanikwa kuburikidza akadzokororwa lithography uye maitiro ari pamusoro, achigadzira matatu-dimensional chimiro.
5.Wafer kuedza
Mushure memaitiro akati wandei ari pamusoro apa, chitete chakagadzira latisi yezviyo.Mamiriro emagetsi ezviyo zvega ega akaongororwa nenzira ye 'yero yetsono'.Kazhinji, huwandu hwezviyo zvechip yega yega yakakura, uye inzira yakaoma kwazvo kuronga pini yekuyedza modhi, inoda kugadzirwa kwakawanda kwemamodheru ane zvakafanana chip zvakatemwa kusvika pazvinogoneka panguva yekugadzira.Iyo yakakwira vhoriyamu, inodzikira mutengo wehukama, ndicho chimwe chezvikonzero nei mainstream chip zvishandiso zvakachipa.
6. Encapsulation
Mushure mekunge wafer yagadzirwa, pini inogadziriswa, uye akasiyana mafomu ekurongedza anogadzirwa zvinoenderana nezvinodiwa.Ichi ndicho chikonzero nei iyo yakafanana chip core inogona kuve neakasiyana ekurongedza mafomu.Semuenzaniso: DIP, QFP, PLCC, QFN, nezvimwewo. Izvi zvinonyanya kusarudzwa nemaitiro ekushandisa kwevashandisi, nharaunda yekushandisa, fomu remusika uye zvimwe zvinhu zvinotenderedza.
7. Kuedza uye kurongedza
Mushure memaitiro ari pamusoro apa, kugadzira chip kwapera, danho iri nderekuyedza chip, kubvisa zvigadzirwa zvakakanganisika, uye kurongedza.
Izvo zviri pamusoro ndizvo zvine chekuita nezve chip kugadzira maitiro akarongwa neGadzira Core Detection.Ndinovimba zvichakubatsira.Kambani yedu ine mainjiniya ehunyanzvi uye indasitiri yakasarudzika timu, ine 3 yakajairwa marabhoritari, nzvimbo yerabhoritari inodarika 1800 square metres, inogona kuita zvemagetsi bvunzo yekuongorora, IC chokwadi kana nhema chiziviso, chigadzirwa dhizaini sarudzo, kutadza kuongorora, kuyedza basa, fekitori inopinda yekuongorora zvinhu uye tepi uye mamwe mapurojekiti ekuyedza.
Nguva yekutumira: Jun-12-2023