OEM PCBA Clone Assembly Service Imwe PCB & PCBA Tsika Yemagetsi PCB Circuit Board

Tsanangudzo

PCB Technical Capacity

Layer Misa kugadzirwa: 2 ~ 58 akaturikidzana / Pilot run: 64 layer

Max. Ukobvu Misa kugadzirwa: 394mil (10mm) / Pilot kumhanya: 17.5mm

Zvishandiso FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead yemahara musangano zvinhu), Halogen-Yemahara, Ceramic yakazadzwa, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, nezvimwe.

Min. Upamhi/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)

Max. Mhangura Ukobvu 6.0 OZ / Pilot kumhanya: 12OZ

Min. Gomba Saizi Mechanical chibooreso: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

Surface Pedzisa HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Kunyudzwa, ENEPIG, Gold Finger

Special process Yakavigwa Gomba, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, uye Resistance control.

PCBA technical Capacity

Zvakanakira -----Professional Surface-mounting uye Kuburikidza-gomba solder tekinoroji

----Masaizi akasiyana se1206,0805,0603 zvikamu zveSMT tekinoroji

----ICT(Muyedzo Yedunhu),FCT(Inoshanda Yedunhu Muedzo)

----PCB Gungano NeUL,CE,FCC,Rohs Kubvumidzwa

----Nitrogen gasi reflow soldering tekinoroji yeSMT.

----High Standard SMT&Solder Assembly Line

----Yakakwira density yakabatana bhodhi yekuisa tekinoroji kugona.

Zvikamu Passive Pasi kusvika 0201 saizi, BGA uye VFBGA, Leadless Chip Vatakuri / CSP

Kaviri-mativi SMT Musangano, Yakanaka Pitch kusvika 0.8mils, BGA Gadzirisa uye Reball

Kuedza Flying Probe Test, X-ray Inspection AOI Test