Ukobvu hwakazara uye huwandu hwezvikamu zvePCB multilayer board zvinoganhurwa nehunhu hwePCB board. Mabhodhi akakosha akaganhurirwa mukukora kwebhodhi iyo inogona kupihwa, saka mugadziri anofanira kufunga nezve bhodhi maitiro ePCB dhizaini maitiro uye zvisingakwanisi PCB kugadzirisa tekinoroji.
Multi-layer compaction process precautions
Laminating ndiyo nzira yekubatanidza imwe neimwe dhizaini yebhodhi redunhu mune yakazara. Iyo yese nzira inosanganisira kutsvoda kutsvoda, kumanikidza kwakazara uye kutonhora kudzvanywa. Munguva yekutsvoda kudzvanya nhanho, resin inopinda munzvimbo yekubatanidza uye inozadza mavhodhi mumutsara, yobva yapinda ichidzvanya kusungirira ma voids ese. Izvo zvinonzi kutonhora kutonhora ndiko kutonhora bhodhi redunhu nekukurumidza uye kuchengetedza saizi yakagadzikana.
Laminating process inoda kutarisisa zvinhu, kutanga pane zvese mudhizaini, inofanirwa kusangana nezvinodiwa zvemukati musimboti bhodhi, kunyanya ukobvu, saizi yechimiro, gomba rekumisa, nezvimwewo, inoda kugadzirwa zvinoenderana nezvinodiwa, iyo yakazara yemukati core board zvinodiwa hapana yakavhurika, pfupi, yakavhurika, isina oxidation, hapana yakasara firimu.
Chechipiri, paunenge uchiisa mabhodhi e-multilayer, mapuranga emukati emukati anoda kurapwa. Maitiro ekurapa anosanganisira dema oxidation kurapwa uye Browning kurapwa. Oxidation kurapwa ndeyekugadzira dema oxide firimu pane yemukati memhangura foil, uye brown kurapwa ndeyekugadzira organic firimu pane yemukati copper foil.
Chekupedzisira, kana laminating, tinofanira kuteerera nyaya nhatu: tembiricha, kumanikidzwa uye nguva. Tembiricha inonyanya kureva tembiricha yekunyunguduka uye tembiricha yekurapa resin, tembiricha yakatarwa yendiro inopisa, tembiricha chaiyo yechinhu uye shanduko yekupisa mwero. Aya ma parameter anoda kutariswa. Kana iri yekumanikidza, musimboti wekutanga kuzadza iyo interlayer mhango neresin kudzinga iyo interlayer magasi uye volatiles. Iyo nguva paramita inonyanya kudzorwa nekumanikidza nguva, kupisa nguva uye gel nguva.
Nguva yekutumira: Feb-19-2024