PCB multilayer compaction inzira inoteedzana.Izvi zvinoreva kuti chigadziko chekuisa chichava chimedu chemhangura foil ine layer ye prepreg yakaiswa pamusoro.Nhamba yezvikamu zve prepreg inosiyana zvichienderana nezvinodiwa zvekushanda.Uye zvakare, iyo yemukati core inoiswa pane prepreg billet layer uye yobva yazadzwa ne prepreg billet layer yakafukidzwa nemhangura foil.A laminate ye-multi-layer PCB inogadzirwa.Isa ma laminate akafanana pamusoro peumwe neumwe.Mushure mekunge mapepa ekupedzisira awedzerwa, murwi wekupedzisira unogadzirwa, unonzi "bhuku," uye murwi wega wega unonzi "chitsauko."
Kana bhuku racho rapera, rinoendeswa kune hydraulic press.Iyo hydraulic press inodziya uye inoshandisa huwandu hukuru hwekumanikidza uye vacuum kubhuku.Iyi nzira inonzi kurapa nekuti inodzivirira kusangana pakati pema laminate uye mumwe nemumwe uye inobvumira resin prepreg kusanganisa nepakati uye foil.Izvo zvikamu zvinozobviswa uye zvakatonhodzwa pakamuri tembiricha kubvumira resin kugadzikana, nekudaro kupedzisa kugadzirwa kwemhangura multilayer PCB kugadzira.
Mushure mokunge mapepa akasiyana-siyana akachekwa zvichienderana nehukuru hwakatarwa, nhamba yakasiyana yemashizha inosarudzwa zvichienderana nehupamhi hwepepa kuti iite slab, uye laminated slab inounganidzwa muchikamu chekutsikirira maererano nekutevedzana kwezvido zvekugadzirisa. .Sunda iyo yekutsikirira unit mumushini welaminating yekutsikirira nekugadzira.
5 matanho ekudzora tembiricha
(a) Preheating nhanho: tembiricha iri kubva mukamuri tembiricha kusvika kune yekutanga tembiricha yekupisa kwepamusoro pekuita, nepo core layer resin inopisa, chikamu chezvinoputika chinoburitswa, uye kudzvanywa kuri 1/3 kusvika 1/2 ye kumanikidzwa zvachose.
(b) Insulation stage: iyo yepamusoro layer resin inorapwa pamwero wakaderera wekuita.Iyo yepakati layer resin inodziya zvakafanana uye yakanyungudutswa, uye iyo interface yeresin layer inotanga kusanganisa pamwe chete.
(c) nhanho yekudziya: kubva pakatanga tembiricha yekurapa kusvika kune yakanyanya tembiricha yakatsanangurwa panguva yekutsikirira, iyo yekupisa yekumhanyisa haifanirwe kunge ichimhanya zvakanyanya, kana zvikasadaro kukurumidza kurapa kwepamusoro pedenga kuchave nekukurumidza, uye haigone kunyatsobatanidzwa iyo core layer resin, zvichikonzera stratification kana kuputika kwechigadzirwa chakapedzwa.
(d) yekugara tembiricha nhanho: kana tembiricha yasvika pakukosha kwepamusoro kuchengetedza nhanho inogara iripo, basa reichi nhanho nderekuona kuti iyo yepamusoro layer resin yapora zvakakwana, iyo yepakati layer resin inofananidzwa plasticized, uye kuve nechokwadi kunyungudika. kusanganiswa pakati pematanho emapepa ezvinyorwa, pasi pechiito chekumanikidza kuti ive yunifomu dense yakazara, uyezve iyo yakapedzwa chigadzirwa kuita kuti uwane yakanakisa kukosha.
(e) Chinhanho chekutonhodza: Kana resin yepakati pepamusoro peiyo slab yanyatsorapwa uye yakanyatsobatanidzwa neiyo core layer resin, inogona kutonhodzwa nekutonhodzwa, uye nzira yekutonhora ndeyekupfuura mvura inotonhorera mundiro inopisa. yemuchina wekudhinda, iyo inogona zvakare kutonhodzwa zvega.Iyi nhanho inofanirwa kuitwa pasi pekuchengetedzwa kwekudzvanywa kwakatarwa, uye mwero wakakodzera wekutonhora unofanirwa kudzorwa.Kana tembiricha yeplate inodonha pasi peiyo tembiricha yakakodzera, kusunungurwa kwekumanikidza kunogona kuitwa.
Nguva yekutumira: Mar-07-2024
