Yakakwirira mhando ENIG PCB yezvokurapa equiment Aerospace yemauto kudzivirira nzvimbo Goridhe 1u”-3u”

Isu tiri kugadzira pcb uye pcb gungano imwe-stop basa mafekitari. vane 400 vanhu vese. 20% kuwedzera kutengesa vhoriyamu gore rega rega. 70% kugadzirwa kwese kubva mhiri kwemakungwa. tinoita 1-12layer.FR4.CEM-1.CEM-3.HDI. AL zvinhu. isu tinogamuchirwa prototypes mirairo. zvakajairika pcb samples nezve 3days tinogona kutumira kune yako mukati me12hour kana 24hour kubhadhara nekukurumidza mari. pcba prototypes nezve 1day inogona kuendesa. smt uye dip uye nemaoko zvikamu zvese zvinogona kuita. sanganisira 0201 zvikamu.BGA. 100% Hunhu vimbiso. nekuda kweFly probe. E-testing sherufu.X-RAY.AOI. Kuongororwa kwebasa rebhodhi rimwe nerimwe. tinogona kugadzira dhizaini marongero kana kukopa bhodhi kana pasina pcb gerber faira uye bom runyorwa. iwe unogona kutumira yako yapfuura sampuli yechokwadi kwatiri kana uine. ndapota ipa shematic diagram. saizi yerondedzero. zvikamu zvinyorwa kana pasina masampuli echokwadi. isu chokwadi kugadzirisa kana kubereka kana kutakura mhando matambudziko mutengo kana mhando kuita mativi edu. chero mhinduro ichapindurwa mukati me5hour. tine ISO9001.TS16949.SGS.UL. ROHS certification. Ndinotarisira kunzwa kubva kwauri munguva pfupi. gamuchira chipo chako nekukurumidza.

Technical parameters
•Zvinhu:FR-4,CEM-3,CEM-1,AL ,HDI,Halogen-isina , Ceramic boards
•Min Solder Mask zambuko:0.1mm
•Mini/max Solder Mask ukobvu:10um-25um
•Min kubata solder dhayamita:0.1mm(divi rimwechete)
•Diameter Kushivirira:PTH ±0.076mm NPTH ±0.05mm
•Kugara neMask (hongu/kwete):Hongu
•Layer Counts:1-12 LAYERS
•Kukora Kwebhodhi:0.4mm—3.5mm
•Hukobvu Kushivirira(t≥0.8mm):0.8 +/-0.1mm;1.2-1.6 +/-0.13mm;2.4 +/-0.18mm;3.2 +/-0.25mm
•Kushivirira Kweukobvu( T<0.8mm):0.4-0.6 +/-0.1mm
•Miraini shoma (0,5OZ):0.10mm(yekuputira goridhe):Minimum Space (0,5OZ)0.10mm(yekuisa goridhe)
•Miraini shoma (1OZ):0.15mm:Minimum Line (2OZ):0.20mm
•Miraini shoma (3OZ):0.25mm:Minimum Space (1OZ):0.15mm
•Minimum Space (2OZ):0.20mm
•Minimum Space (3OZ):0.25mm
•Out Layer Copper Kukobvu: 0.5-2OZ
•Inner Layer Copper Ukobvu: 0.5-2OZ
•Min Drilling Hole(Yapera):0.25mm
•Annular mhete:0.1mm Kunyoresa:±0.1mm
•Aspect ratio:Kuburikidza nemakomba - 8:1
• Solder Mask ruvara:Green, dema, tsvuku, chena. Mini. Solder Mask Clearance: 0.05mm
•Ruvara rwengano:Green, chena, tsvuku,yero, dema.
•Maximum Board Size:500x600mm
•Twist and Bow (yeSMT iunganidze):≤0.75%
Ukobvu Tin/Lead HASL:5-25um