Layer | 1-2 Matanho |
Akapedza Kukora | 16-134mil (0.4mm-3.4mm) |
Max. Dimension | 500mm * 1200mm |
Copper Kukora | 35um, 70um, 1 kusvika 10oZ |
Min Line Width/Space | 4mil (0.1mm) |
Min Akapedza Gomba Saizi | 0.95mm |
Min. Drill Size | 1.00mm |
Max. Drill Size | 6.5mm |
Yakapedzwa Hole Saizi Kushivirira | ± 0.050mm |
Aperture Position Precision | ± 0.076mm |
Min SMT PAD Size | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm(2mil) |
Min.Solder Mask Cover | 0.05mm(2mil) |
Solder mask Ukobvu | >12um |
Surface Finishing | HAL, HAL Lead yemahara, OSP, Kunyudza Goridhe, nezvimwe |
HAL Ukobvu | 5-12um |
Kunyudza Kukora Kwegoridhe | 1-3mil |
OSP Firimu Ukobvu | ENTEK PLUS HT: 0.3-0.5um; F2:0.15-0.3um |
Outline Kupedzisa | Routing & Punching; Precision Kutsauka ± 0.10mm |
Thermal Conductivity | 1.0 kusvika 12w/mk |
FOB Port | Shenzhen |
Export Carton Dimensions L/W/H | 36 x 26 x 25 Masendimita |
Nguva Yekutungamira | 3-7 mazuva |
Units per Export Carton | 5.0 |
Export Carton Weight | 18 makirogiramu |