Iwe unonzwisisa here iyo miviri mitemo yePCB laminated dhizaini?

Iyi inotevera muenzaniso wembiri-layer kusvika masere-layer stack:

• A.single-side PCB bhodhi uye kaviri-rutivi PCB bhodhi laminated

Pazvikamu zviviri, nokuti nhamba yezvikamu zvishoma, hapana dambudziko rekugadzirisa.EMI radiation control inotariswa zvakanyanya kubva kune wiring uye marongero;

Iyo electromagnetic kuenderana kweimwe - layer uye kaviri - layer mahwendefa ari kuramba achiwedzera mukurumbira.Chikonzero chikuru chechiitiko ichi ndechekuti nzvimbo yechiratidzo chechiratidzo yakakura kwazvo, iyo isingangobudisi simba remagetsi emagetsi, asiwo inoita kuti dunhu rinzwe kukanganiswa kwekunze.Iyo yakapusa nzira yekuvandudza iyo electromagnetic kuenderana kwemutsara ndeyekudzikisa loop nzvimbo yechiratidzo chakakosha.

Chiratidzo chakakosha: Kubva pamaonero ekuenderana kwemagetsi, chiratidzo chakakosha chinonyanya kureva chiratidzo chinoburitsa mwaranzi yakasimba uye inonzwa kune yekunze.Masaini anogona kuburitsa mwaranzi yakasimba kazhinji zviratidzo zvenguva nenguva, senge masaini mashoma ewachi kana kero.Kuvhiringidza masaini masaini ndeaya ane mwero wakaderera weanalogi zviratidzo.

Single uye kaviri layer mahwendefa anowanzo shandiswa mune yakaderera frequency simulation dhizaini pazasi 10KHz:

1) Kufambisa tambo dzemagetsi pachikamu chimwe chete nenzira yeradial, uye kuderedza huwandu hwehurefu hwemitsara;

2) Paunenge uchifamba magetsi uye waya yepasi, pedyo nemumwe;Isa tambo yepasi pedyo newaya yemakiyi padyo nepaunokwanisa.Saka, diki loop nzvimbo inoumbwa uye kunzwisiswa kweiyo differential mode radiation kune kupindira kwekunze kunoderedzwa.Kana tambo yepasi yakawedzerwa pedyo netambo yechiratidzo, dunhu rine nzvimbo duku kudarika inoumbwa, uye ikozvino chiratidzo chinofanira kuendeswa kuburikidza nedunhu iri pane imwe nzira yepasi.

3) Kana iri kaviri-layer redunhu bhodhi, inogona kuva kune rumwe rutivi rwebhodhi redunhu, pedyo nemutsara wechiratidzo pazasi, pamwe chete nejira rechiratidzo jira repasi, mutsara wakafara sezvinobvira.Nzvimbo yedunhu inoguma yakaenzana nehupamhi hwebhodhi redunhu rinowedzerwa nehurefu hwemutsara wechiratidzo.

• B. Lamination yezvikamu zvina 

1. Sig-gnd (PWR)-PWR (GND)-SIG; 

2. GND-SIG(PWR)-SIG(PWR)-GND; 

Kune ese ari maviri eaya madhizaini akagadzirwa, dambudziko rinogona kuitika nderechinyakare 1.6mm (62mil) ndiro ukobvu.Layer spacing ichave yakakura, kwete chete inobatsira kudzora impedance, interlayer coupling uye nhovo;Kunyanya, nzvimbo yakakura pakati pesimba rekupa strata inoderedza capacitance yeplate uye haigone kusefa ruzha.

Nokuda kwechirongwa chekutanga, chinowanzoshandiswa munyaya yenhamba yakawanda yemachipisi pabhodhi.Ichi chirongwa chinogona kuwana zvirinani kuita kweSI, asi EMI kuita hakuna kunaka, iyo inonyanya kudzorwa ne wiring uye zvimwe zvinhu.Kunyanya kutarisisa: Iyo maumbirwo anoiswa muchiratidzo chechiratidzo cheyakanyanya dense chiratidzo dhizaini, inobatsira kunyura uye kudzvinyirira kwemwaranzi;Wedzera nzvimbo yeplate kuratidza mutemo we20H.

Kune yechipiri chirongwa, inowanzoshandiswa apo chip density pabhodhi yakaderera zvakakwana uye pane nzvimbo yakakwana yakapoteredza chip kuti uise simba rinodiwa copper coating.Muchirongwa ichi, iyo yekunze yePCB yese stratum, uye maviri epakati akaturikidzana chiratidzo / simba layer.Simba rekupa pane chiratidzo chechiratidzo chinofambiswa nemutsara wakafara, unogona kuita kuti nzira yekuvharisa kwesimba remagetsi rive rakaderera, uye iyo impedance yechiratidzo che microstrip nzira zvakare yakadzikira, uye zvakare inogona kudzivirira iyo yemukati chiratidzo mwaranzi kuburikidza nekunze. layer.Kubva pane EMI kutonga kwemaonero, iyi ndiyo yakanakisa 4-layer PCB chimiro chiripo.

Kunyanya kutarisisa: iyo yepakati maviri akaturikidzana echiratidzo, simba rekusanganisa layer spacing inofanira kuvhurwa, kutungamira kwemutsara kwakamira, dzivirira crosstalk;Yakakodzera control panel nzvimbo, inoratidza 20H mitemo;Kana iyo impedance yewaya ichizodzorwa, nyatso gadzira waya pasi pezvitsuwa zvemhangura zvemagetsi uye pasi.Uye zvakare, iyo magetsi kana yekuisa mhangura inofanirwa kubatanidzwa zvakanyanya sezvinobvira kuve nechokwadi cheDC uye yakaderera frequency yekubatanidza.

• C. Lamination of six layers of plates

Nekugadzirwa kwepamusoro chip density uye high clock frequency, dhizaini ye6-layer board inofanirwa kutariswa.Iyo lamination nzira inokurudzirwa:

1.SIG-GND-SIG-PWR-GND-SIG; 

Pachirongwa ichi, chirongwa chelamination chinowana kutendeseka kwechiratidzo chakanaka, nechiratidzo chechiratidzo chiri padhuze negiyo repasi, dhizaini yemagetsi yakapetwa neyakagadzika pasi, iyo impedance yeimwe neimwe nzira yenzira inogona kudzorwa zvakanaka, uye ese ari maviri mitsara anogona kutora magineti mitsara zvakanaka. .Uye zvakare, inogona kupa zvirinani nzira yekudzoka kune yega yega chiratidzo chechiratidzo pasi pemamiriro emagetsi akazara uye kuumbwa.