| Layer | 1-32 layers |
| Zvishandiso | CEM1,CEM3,Teflon,Rogers,FR-4,High Tg FR-4,Aluminium Base,Halogen Yemahara |
| Max. Board Size | 510 * 1200mm |
| Material | RoHS Directive-inoenderana |
| PCB ukobvu | 1.6 ±0.1mm |
| Kunze Layer Copper Kukora | 1-6oz |
| Inner Layer Copper Kukora | 1/2oz-5oz |
| Max. board Ukobvu | 6.0mm |
| Minimum gomba saizi | 0.20mm |
| Minimum mutsetse upamhi/nzvimbo | 3/3mil |
| Min. S/M Pitch | 0.1mm(4mil) |
| Plate ukobvu uye aperture ratio | 30:1 |
| Minimum gomba mhangura | 20µm |
| Hole dia. Kushivirira(PTH) | ±0.075mm(3mil) |
| Hole dia. Kushivirira(NPTH) | ±0.05mm (2mil) |
| Gomba chinzvimbo kutsauka | ±0.05mm (2mil) |
| Rondedzera kushivirira | ±0.05mm (2mil) |
| Surface yapera | HASL Leadfree,Kunyudzwa ENIG,Chem Tin,Flash Goridhe,OSP,Chigunwe chegoridhe,Inopepetwa,Kunyudzwa Sirivha |
| Solder mask | girinhi |
| Legend | chena |
| Outline | nzira uye zvibodzwa/V-cheka |
| E-test | 100% |
| Inspection standard | IPC-A-600H/IPC-6012B, Kirasi 2 |
| Mishumo inobuda | kuongorora kwekupedzisira, E-bvunzo, solderability bvunzo, micro chikamu uye nezvimwe |
| Zvitupa | UL (E315391), ISO 14001, TS16949, ISO 9001, SGS |
A: PCB: Huwandu, Gerber faira uye Technic zvinodiwa (zvinhu, pamusoro pekupedzisira kurapwa, mhangura ukobvu, bhodhi ukobvu,...).
PCBA: PCB ruzivo, BOM, (Mapepa ekuedzwa ...).
A: Gerber faira: CAM350 RS274X
PCB faira: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF, izwi, txt).
A: Mafaira ako akachengetwa mukuchengetedzwa kwakakwana uye kuchengeteka.Tinodzivirira pfuma yeuchenjeri kune vatengi vedu mubasa rose.
A: Iko hakuna MOQ. Isu tinokwanisa kubata Diki pamwe nehombe vhoriyamu kugadzirwa nekuchinjika.
A: Mutengo wekutumira unotarwa nenzvimbo, uremu, saizi yekutakura zvinhu. Ndapota tizivise kana iwe uchida kuti titaure iwe mutengo wekutumira.
A: Ehe, tinogona kupa chikamu sosi, uye isu tinobvumawo chikamu kubva kumutengi.